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Principal Microelectronics Semiconductor Process Engineer-20001273

Location: Apopka
US Citizenship Required for this Position: Yes
Relocation Assistance: Yes
Clearance Type: Secret
Number of Openings : 1
Shift : 1st Shift
Description

Northrop Grumman Mission Systems is seeking talented and motived process and equipment engineers to work at a new advanced packaging facility. Northrop Grummans semiconductor foundry and packaging lines are unique capabilities supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development. Our devices enable a number of Northrop Grummans ground based radars, avionic radars, and space systems.


The wafer bumping line, located in Apopka, FL, will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions, including tin/
lead, lead-free, microbumps, and copper pillar, using sputter, electro and electro-less plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging.


Join us for the chance for hands-on work with a small, experienced and talented team while helping serve your country.  Enjoy the opportunity to grow and learn with a variety of challenging projects in production, R&D, ongoing long-term
programs, and new programs targeting future military platforms.


Responsibilities include:
- Installing and qualifying new process tools and recipes.
- Sustaining equipment and processes, including running process qualifications, process and equipment troubleshooting, technician training and certification, and process safety.
- Developing and optimizing new process flows.
- Supporting statistical process control (SPC) and continuous improvement efforts.
-Writing and maintaining process documentation. Determining preventative maintenance procedures and schedules.

 

 

 

 

FLOMSTR

Qualifications

Basic Qualifications:

-BS Degree in Electrical Engineering, Materials, Chemistry, Physics, or related technical discipline with 5 years of relevant semiconductor experience (3 with an MS).

 

Hands-on experience in one of the following semiconductor process/equipment areas:

 

- Electrochemical or electroless plating of one or more typical bump metallurgies (Pb/Sn, SnAgCu, SnAg, Cu, Ni, etc).

 

- Contact lithography and photoresist chemistries and processing.

 

- Wet chemistries for metal etching (Ti, TiW, Ni, Cu).

 

- Sputter deposition of one or more typical UBM films (Ti, TiW, Ni, Cu).

 

- Solder sphere transfer / ball drop processing.

 

- Wafer dry and wet clean processes.

 

Must be a US Citizen and able to obtain and maintain a Secret clearance

 

 

 

 
 

Preferred Qualifications: 

 

-Experience in wafer bumping or packaging lines

-Experience in low volume/high product mix environments

-Hands-on experience in two or more of the following semiconductor process/equipment areas:

- Electrochemical or electroless plating of one or more typical bump metallurgies (Pb/Sn, SnAgCu, SnAg, Cu, Ni, etc)

- Contact lithography and photoresist chemistries and processing

- Wet chemical processes for metal etching (Ti, TiW, Ni, Cu)

- Sputter deposition of one or more typical UBM films (Ti, TiW, Ni, Cu)

- Solder sphere transfer / ball drop processing

- Wafer dry and wet clean processes

-Personal Clearance Level- Secret

 

 


 

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.

Job ID: 20001273

What's great about
Northrop Grumman

  1. Be part of a culture that thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work..
  2. Use your skills to build and deliver innovative tech solutions that protect the world and shape a better future.
  3. Enjoy benefits like flexible work schedules, education assistance and paid time off.
Secret Required
Yes, 25 % of the Time
No - Teleworking not available for this position