Northrop Grumman Mission Systems is seeking talented and motived process and equipment engineers to work at a new advanced packaging facility. Northrop Grummans semiconductor foundry and packaging lines are unique capabilities supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development. Our devices enable a number of Northrop Grummans ground based radars, avionic radars, and space systems.
The wafer bumping line, located in Apopka, FL, will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions, including tin/
lead, lead-free, microbumps, and copper pillar, using sputter, electro and electro-less plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging.
Join us for the chance for hands-on work with a small, experienced and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in production, R&D, ongoing long-term
programs, and new programs targeting future military platforms.
- Installing and qualifying new process tools and recipes.
- Sustaining equipment and processes, including running process qualifications, process and equipment troubleshooting, technician training and certification, and process safety.
- Developing and optimizing new process flows.
- Supporting statistical process control (SPC) and continuous improvement efforts.
-Writing and maintaining process documentation. Determining preventative maintenance procedures and schedules.